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Laserator TUWANA XYZ-G96 Laser Precission Work Station

Laserator TUWANA Precission Laser Machining  

Laserator High-power Picosecond Ultra-Fast Laser is a high performance-to-price ratio product which is aimed to micro processing field. The whole system guarantee products’ high reliability by main oscillator amplification structure, high reliable seed laser and minimalism route design. In order to realize the best processing performance, products have both programmable Burst Mode and POD trigger function, it is the best choice for precision processing.

TUWANA XYZ-G96 can also be applied to OLED/LED Dicing, PI Film Scribing, PET Film Scribing, Polarizing Film Scribing and Medical Film Scribing field. Also an excellent tool for Glass Marking, Sapphire Marking, Semiconductors Cutting and Ceramic Cutting work. More suitable for Cathode Tab Welding, Solar Panels Coating, Wafer Cutting and other highend process applications.


THE INDUSTRIES WHERE TUWANA XYZ-G66 WORKSTATIONS CAN BE OPERATED

  • Automotive Industry
  • Photo-Voltaic Cell Manufacturing
  • Lens Manufacturing
  • PCB Board Manufacturing
  • Lithium-Ion Battery Manufacturing
  • Semiconductor Manufacturing


TUWANA XYZ-G96 SPECIFICATIONS

  • X:900mm, Y:600mm, Z:200mm Volumetric Lasing Environment
  • Granite Work Table Dimensions: 1000X1000X100mm
  • Unique & Innovative Laserator 10mm 2D Galvo Scan Head
  • A Strengthful Combination of Steel & Granite
  • Rigidity by Its Heavy Duty Large Damping Feet
  • 2000kgs in Weight
  • Granite Worktable, Colum, & Steel Cars
  • Automatic 3-Piece Synchronous Door with a Laser Protective Glass at Front and Manual Doors at Both Sides
  • Powerful Emission & Filtration System for Dust & Smoke
  • Finger Protection Sensors at Front Door
  • User Defined Many Types of Laser Sanding Operations
  • Inner-Enclosure Day-Light LED-Illumination Lamps
  • UV, Green & Fiber Laser Engines to Choose From
  • XY Axes are Lineer Servo Motor Driven
  • Climate Control For Automation Panel


OPTIONAL SPECIFICATIONS

  • 3 Axis Lasing w/ a 3D Galvo Scan Head
  • 4 Axis Machining w/ a Rotary Axis
  • 4 or 5 Axis Machining w/ a C Axis
  • Positioning with Coaxial or Paraxial Cameras
  • Camera for close follow-up of lasing operation out of the enclosure
  • One of UV, Green, Fiber Laser Options
  • 3D Digital Scanner for Digitizations of 3D Parts
  • Optional Coaxial Camera for Exact Positioning
  • Optional Paraxial Cameras for Depth Measurement
  • Optional Red & White LED-Light Local Illumination Rings
  • Optional 1D, 2D Code Reading Camera, and Software

The Laser Technologies Used in This Work Station are For The Following Operations.

UV Laser—Low Power
 MarkingRigid/ Flex PCB, Stainless Steel, Plastic, Ceramic, Glass, Silicon, Sapphire, Ceramic, IC Package, AIN, Alumina.
 ScribingHigh Density Interconnect(HDI), Ceramic, ITO, Glass, Silicon, Sapphire, GaAs, Low-k, Gan, AllnGaN, Glass, Copper
 MicromachiningNickel, Platinum Foil, PET
 Engraving and Rapid   PrototypingCopper, Stainless Steel


UV Laser—Mid Power
 MarkingRigid/ Flex PCB, Stainless Steel, Plastic, Ceramic, Glass, Silicon, Sapphire, Ceramic, IC Package, AIN, Alumina.
 ScribingHigh Density Interconnect(HDI), Ceramic, ITO, Glass, Silicon, Sapphire, GaAs, Low-k, Gan, AllnGaN, Glass, Copper
 TrimmingResistors, Inductors, Ceramic
 DepanelingRigid PCB, Flex PCB
 DrillingRigid PCB, Flex PCB, Glass, Silicion interposer(TSV), Glass Interposer, LTCC tape, Alumina/Ceramic, Solar/Photovoltaic



Green Laser—Mid Power
 MarkingRigid/ Flex PCB, Stainless Steel, Plastic, Ceramic, Glass, Silicon, Sapphire, Ceramic, IC Package, AIN, Alumina.
 CuttingRigid PCB, Flex PCB, Glass, Die Attach Film (DAF), Stainless Steel, Aluminum, Copper, Kevlar, Lithium-Ion Battery Flap
 DrillingRigid PCB, Flex PCB, Glass, Silicion Interposer (TSV), Glass Interposer, LTCC Tape, Alumina/Ceramic, Solar/Photovoltaic
 MicromachiningNickel, Platinum Foil, PET
 TrimmingResistors, Inductors, Ceramic


Picosecond Laser—Mid Power
 MicromachiningFlat Panel Display Manufacturing,
Thin Film Micromachining,
Two-Photon Polymerization,
Precision Micromachining
 MedicalMedical Device Fabrication,
Cardiovascular Stent Manufacturing
 Bio-ImagingMultiphoton Microscopy, Multimodal Imaging, CARS, SRS, SHG/THG, OCT, STED
 Scientific ResearchMulti-Dimensional Spectroscopy, THz Spectroscopy, Coherent Control, CARS, SRS, Fluorescence Up Conversion, Transient Absorption, OPA, OPO Pumping, High Harmonic Generation, EUV


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